MPP & KnS Manual Workholder Setup
Workholder Setup: Adjusting the correct working height for a Micro Point Pro (MPP) or Kulicke and Soffa (K&S) manual wire bonder workholder (IKB-006)
Workholder Setup: Height Adjustment and Setup
- Apply power to the bonder and wait for the machine to initialise.
- Set the LOOP value to 1.
- Remove the work-holder from the bonding area.
- Press and release the chessman button (bonding button) to bond in free air; this will move the bond-head downwards to the loop position.
- Hold the work-holder static in the middle and by rotating the base the height can be adjusted.
a. Rotate clockwise to raise workholder height.
b. Rotate anti-clockwise to lower workholder height. - Rotate workholder anticlockwise fully to lowest position.
- Load workholder (with product to bond).
- Position workholder under the bonding tool.
- Looking through the microscope raise work holder until lowest bonding surface is just touching the tool.
- Press the RESET button, the machine will now initialise.
- Increase the LOOP parameter to a higher value (4 – 5) to ensure good clearance above product.
- The work holder height is now setup correctly.


Workholder Setup: Troubleshooting
- Problem: – The work-holder will not move in any direction (upwards or downwards).
- Resolution: – The spring grub screws are too tight, loosen all 3 grubs screws slightly until rotation is possible.

View the range of “MPP Equipment for Wire Bonding” (formerly KnS manual wire bonders).
Author
Date
Version
Author
Matt Houston
Date
28 April 2017
Version
IKB006 Rev. 3
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Author Biography
Matt Houston is a Sales Engineer at Inseto with over 16 years of experience in the microelectronics and semiconductor industry. His background spans process engineering, technical support and technical sales.
He began his career as a Process Engineer at C‑MAC in Great Yarmouth, working on die bonding and wire bonding for high‑reliability, high‑temperature electronic components, opto‑electronics and multi‑chip modules.
At Inseto, Matt has developed broad hands on experience across a range of semiconductor equipment through installations, training and process support. This enables him to support customers in selecting tailored solutions that meet specific technical requirements.

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